Meet Aegis
Aegis stands at the forefront of thermal management, delivering advanced liquid cooling solutions tailored for the fast-evolving AI and data center landscape.
Designed to meet the industry’s growing demands, Aegis systems offer the performance, reliability, and innovation needed to support next-generation computing—keeping you ahead in a world driven by data and intelligence.
The Liquid Cooling Revolution
Cooling AI with AI: AI-driven thermodynamic simulation combined with additive manufacturing reshapes the supply chain—optimizing both time and cost—while reinforcing AI infrastructure performance.
TurboPlates™ Advantage
TurboPlate™
A patented 3D-printed microchannel heat sink that enables stable two-phase boiling via curved channels and engineered nucleation cores—addressing flow instability and wall superheat to deliver high-density heat rejection for AI chips in a compact form.
Aegis-CDU™ System
Scalable, Modular
Cooling Solutions
Our Two-Phase Coolant Distribution Unit (CDU) is engineered for next-generation data center cooling—where high-density workloads, AI clusters, and HPC environments demand maximum thermal efficiency, system reliability, and operational cost reduction.
Aegis is powered by Airsys – decades of expertise
Airsys has 30 years of experience in precision thermal control for critical industries including mission-critical data centers, medical imaging, and semiconductors. Aegis is leveraging that knowledge & infrastructure to accelerate AI cooling technologies.
Sustainable Solutions
Eco-friendly AI Cooling: innovative solutions with zero water usage. Aegis technology improves thermal performance while reducing material waste through 3D printing. By optimizing heat management, we contribute to lower energy consumption and enhanced system longevity, while offering substantial heat reuse capabilities.
Cooling for the Future
Aegis: Redefining AI Cooling
Limits – future-proof your data center today
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The future of liquid cooling is here
The future of liquid cooling is here