Precision-Cooled
Performance Block
Precision-Cooled. Performance-Driven
Aegis delivers the industry’s first full-stack, two-phase flow boiling, liquid cooling system, engineered for today’s most demanding compute environments.
This closed-loop, modular solution provides unmatched cooling density, real-time responsiveness, and rapid scalability — from edge to hyperscale.
Built to scale. Built for AI.
3D-Printed Microchannel Plate
One Print. No Compromise
Aegis cold plates are fully 3D-printed in a single pass — no welding, no assembly, and no thermal tradeoffs.
Our thin-wall, microchannel design delivers ultra-compact, high-efficiency heat transfer with:
- 50% lower thermal resistance than machined plates
- Up to 80% material savings and significantly reduced weight
- Custom geometries for emerging chip architectures
Additive by nature. Aggressive by performance.
Direct Vaporization at the Heat Source
Boil Where It Matters
Aegis uses two-phase flow boiling directly on-chip — combining the best of boiling and forced convection. By flow boiling, we could achieve:
- Instant thermal responsiveness
- Lower junction temps and tighter delta T
- Stable and consistent flow inside the microchannel
It’s not immersion. It’s precision.
Development Speed & Lead Time
Thermal Design in Days. Not Months
From digital simulation to printed cold plate prototype, our thermal development cycle is measured in days, not quarters.
- Full DfAM (Design for Additive Manufacturing) flow
- 7-day concept-to-print turnaround
- U.S.-built systems delivered in 60 days
- No MOQs — scale up when you’re ready
Engineered for iteration. Built for acceleration.
Agile Manufacturing
Global Supply Chain? No Thanks
Aegis Technologies eliminates tooling delays, freight bottlenecks, and tariff burdens through localized, just-in-time production.
- Metal 3D printing replaces CNC queues
- Materials sourced from the U.S. and EU
- 48-hour SLA on critical spares
- 60-day lead time from order to rack-ready system
From design to deployment — without crossing an ocean.
Sustainability
Zero Water. Near-Zero Waste
Aegis liquid cooling is as efficient for the planet as it is for your servers.
- Closed-loop dielectric means WUE = 0
- Additive manufacturing eliminates machining waste
- pPUE could be as low as 1.05
- No immersion oils, no drain tanks, no hazardous handling
- Reduced shipping and packaging footprint
High performance, low impact.
Performance Metrics (Stats)
Quantified. Verified. Delivered.
Aegis is built for measurable, repeatable, real-world results.
| Metric | Performance |
|---|---|
| Thermal Resistance | ↓50% vs CNC plates |
| Design-to-Print Time | 7 days |
| System Lead Time | 60 days |
| Water Usage | 0 L (WUE = 0) |
| pPUE | ≤ 1.05 |
| Material Efficiency | ↑80% (via 3D printing) |
This is what next-gen cooling looks like in numbers.
Technology + Awards Overview
Built to Win. Proven to Lead
Aegis technology is trusted by the world’s most demanding compute environments — and recognized globally for innovation.
Recent awards and industry validation:
- DCR Excellence Award 2025 – Data Centre Cooling Product of the Year
- Frost & Sullivan 2025 – North American Cooling Company of the Year
Backed by Airsys, built by the team delivering next-gen AI thermal infrastructure.
Recognized. Reliable. Ready to scale.
Ready to Print Your Thermal Future?
Engineer Your AI/HPC Thermal Strategy with Aegis